Ƚ ()
౹ /
/ ʼ
߰
(12)
˻з
Ű
۹
ɿ
ļ нó
ؿܹ
۴
ݵü
2 ֱ CMP []
8 PCB
15 SMT Smart Factory
18 FPGA/PLD ֱ (SoC)
23 ߱ IC ݵü å []
27 ݵü []
32 -TSMC ҷ Ű з
÷
36 ߱ гξ ֱ
43 ΰ κ []
46 ΰռ (ҿ)
ҽ
56 ѱ ȸ Ư
61 ȸ
62 Ư
66 Ű
68 å
70 2 ű
34 ݵü
67 û
72 ȣ
2 2017 (JEITA)
5 2017 ڵ̽
7 3D NAND ڿ 丮 ȭ
10 IoT ô뿡 丮(storage)
12 ݵü IT Ը M&A()
14 ݵü ̿(LD) ο
17 ֱ CMP []
21 ݵü []
27 FOWLP ݵü (Molding)
32 EL TADF
37 LED ο ô
41 IoT(ʼ )
45 IoT Ǵ ΰ(AI) Ȱ
47 ΰ κ []
54 ҽ & ǰ Ұ
63 ȸ
64 Ư
67 Ű
70 1 ű
30 ݵü
54 û
Contents
2017. 2 / No.318
2 ؼ ݵü ֿ ȴ.
4 ߱ Ʈ
10 ݵü Ȳ
16 Packaging(Bonding)
25 ȯ溸, Ư
28 Ⱑ ó
33 Lithography Photoresist ()
38 ڵ ÷
41 EL ÷, ȭ
44 ߱ EL гΰ Ǽ
46 ڵ
60 Ư
63 Ű
64 å
68 12 ű
70 ȸ
52 ݵü
71 û
2017. 1 / No.317
2 2016 ̽ 10
4 2017 ڵ̽
7 Lithography Photoresist ()
16 ÷ ݵü
26 ݵü Ŀ帮 OSAT
30 ֿ OSAT FOWLP å
38 EL
48 (QD) ÷ Ȯ
60 ҽ & ǰ Ұ
66 å
68 11 ű
36 ݵü